| Thermal Properties |
| As the coefficient of thermal expansion of Borosil glass is low , the thermal stresses under a given temperature gradient are consequently low and the glass can withstand higher temperature gradients and also sudden temperature changes/thermal shocks. Minute scratching of glass surface an however reduce its thermal resistance. |
| In general the strain point should be regarded as the maximum safe operating temperature of Borosil ® labware. When heated above 500°C the glass may acquire permanent stresses on cooling. |
| All Borosil ® labware is annealed in modern Lehr oven under strictly controlled conditions to ensure minimal residual stress in the products. |
| The typical thermal properties of borosil glassware are given below: |
Typical Thermal Properties |
| Coefficient of Linear Expansion |
32.5x10-7/°C |
| Strain Point |
515°C |
| Annealing Point |
565°C |
| Softening Point |
820°C |
| Specific Heat |
0.2 |
| Thermal Conductivity Cal/cm3°C/sec) |
0.0027 |
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